●特征与用途Features:
树脂模压封装、密封性好、片式、易集成、有极性。
Epoxy molded encapsulation, well-sealed, Chip, Easy for Integration，Heteropolarity;
体积小、重量轻、电性能优良稳定、寿命长、可靠性高、贮存稳定性好。
Small in size，Light in Weight，Stable in electrical &storage performances , Long life-span，High reliability；
适用于卫星、通讯、摄影、计算机等电子设备的表面贴装电路。
Applying in Satellite，Telecommunications，DV，Computer，such Electrical Equipments with SMT DC& Impulse Circuit.
执行标准：QJ/PWV109-2003
Operative Standard: QJ/PWV109-2003
订货格式：CA45-D-10V100μF-M：1000只
Ordering Information: CA45-D-10V100μF-M：1000pcs
●主要技术性能Technical Performances