多芯组合无包封堆叠多层瓷介电容器
特征与应用
·由两个或多个多层片式瓷介电容器堆叠无包封，能获得2倍或3倍的容量，且节省了线路板的占用面积；
·介质为Ⅱ类瓷介，电容器容量体积比大；
l Class II Ceramic Dielectric, Large Capacitance Volume;
·有更低的ESR和ESL可确保高频开关电源的优良性能，在大电流高频环境下的性能远远优于铝电解电容或钽电解电容，能替代钽电容；
Lower ESR and ESL could ensure the nice-feature of High frequency switching power supply, such MLCC has more advanced performances than tantalum capacitors and aluminum capacitors in high volume & frequency environment, even it can instead of tantalum capacitors in some cases.
·无极性，安装方便，适合用作印制电路的表面贴装元件；
Non-polarity, easier for mounting, suit for surface mount component which has printed circuit;
·产品100%进行温度冲击和高温电负荷筛选；
Have experienced 100% Thermal Shock & High-Temperature Electron-Load Screening;
·主要用于DC-DC转换器、高容量放电电路、开关电源、滤波器、去耦装置等；
Main used in DC-DC Converter, High Capacity Discharge Circuit, Switching power supply, Filters, Isolators;
主要性能指标及执行标准Main Characteristics:
·使用温度范围：BX（X7R）：-55℃~125℃、BR（X5R）：-55℃~85℃
Operating Temperature Range: BX（X7R）：-55℃~125℃、BR（X5R）：-55℃~85℃
·温度特性 : ±15%；
Temperature Characteristics:±15%；
·老化特性：每十进制小时最大为3%；
Aging Characteristics: 3% at most per hour through Decimal System;
·损耗角正切值： 见下表；
DF（tgδ）： See tables below;
·绝缘电阻：在25℃，不低于10000MΩ或100MΩ·μF取较小者；
Insulation Resistance: at 25℃, not lower than 100000MΩ或1000MΩ·μF.Choose the smaller one
·介质耐压：2.5UR；
Dielectric Withstanding Voltage：2.5UR
订货示例Ordering Information