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CT45

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多芯组合环氧树脂模压封装多层瓷介电容器
特征与应用
 
·环氧树脂模压封装,表面贴装结构;外形尺寸与片式钽电容的外形体积相近,可与片式钽电容实现直接互换,无需改版;
High-density Molded Epoxy Encapsulation, Suit for Surface Mount Circuit, Dimensions and functions alike Chip Tantalum capacitors, this two kinds of capacitors could Exchange in the same working environment;
·由两个或多个多层片式瓷介电容器堆叠封装,能获得2倍或多倍的容量;
·介质为Ⅱ类瓷介,电容器容量体积比大;
l         Class II Ceramic Dielectric, Large Capacitance Volume;
·与片式钽电容相比,有更低的ESR和ESL值,耗散功率是钽电容的1/4,且无极性安装方便,耐电压高;
Comparing with Chip tantalum capacitors, this Series of MLCC has lower ESR and ESL, Dissipated power is 1/4 of Chip tantalum capacitor, Electrodeless, Easier for mounting, Resist high voltage.
·产品100%进行温度冲击和高温电负荷筛选;
l         Have experienced 100% Thermal Shock & High-Temperature Electron-Load Screening;
·高频特性好,效率高,当频率高于50KHz,可用1/2~1/10的容量替代片式钽电容器,效果更佳;
Excellent in High-Frequency Characteristics, When Frequency is more than 50KHz, is better to Use MlCC which’s capacitance is 1/2~1/10 capacitance of Lead Tantalum Capacitor;
 
主要性能指标及执行标准Main Characteristics:
·使用温度范围:BX(X7R):-55℃~125℃、BR(X5R):-55℃~85℃
 Operating Temperature Range: BX(X7R):-55℃~125℃、BR(X5R):-55℃~85℃
·温度特性 : ±15%;
 Temperature Characteristics:±15%;
·老化特性:每十进制小时最大为3%;
 Aging Characteristics: 3% at most per hour through Decimal System;
·损耗角正切值: 见下表;                        
 DFtgδ): See tables below;
·绝缘电阻:在25℃,不低于10000MΩ或100MΩ·μF取较小者;
 Insulation Resistance:at 25, not lower than 100000MΩ或1000MΩ·μF.(Choose the smaller one)
·介质耐压:2.5UR
 Dielectric Withstanding Voltage2.5UR
·执行企军标:QJ/PWV408-2010
 Executive Company StandardQJ/PWV408-2010
 
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